Parameter:
Layers: 1L
material: Copper Substrate
Board Thicknes: 1.6 mm
Copper Thicknes: 35 um
Line/Space: 20 mil
Smallest Hole Diameter: 2.0mm
Surface Treatment: Lead Free HASL
Solder Mask: Fujita(LE-600)

Technical Feature:
288℃.10s, No Layering, No Sparkling, Breakdown Voltage: 2KV

Application:
High-Power power supply