PCB Manufacturing Capability
|
| Category |
Item |
Standard |
Advanced |
| Basic |
Rigid PCB Layer Count |
1-40L |
50L |
| Flex & Rigid-Flex PCB Layer Count |
Flex PCB: 1-8L |
Flex PCB: 1-10L |
| Rigid-flex PCB: 2-16L |
Rigid-flex PCB+HDI: 2-20L |
| Min. Fnished Board Thickness |
0.2 ± 0.05mm(8 ± 2mil) |
0.15 ± 0.025mm(6 ± 1mil) |
| Max. Fnished Board Thickness |
6.5 ± 10%mm(256 ± 10%mil) |
10.0 ± 10%mm(394 ± 10%mil) |
| Max.Board/Array Size |
1060mm*610mm(41*24inch) |
1810mm*660mm(71*26inch) |
| Min. Core Thickness |
0.05mm(2mil) |
0.034mm(1.34mil) |
| Stackup |
Through-hole PCB |
YES |
YES |
| Mechanical-Blind/buried via PCB |
YES |
YES |
| Metal Base PCB |
YES |
YES |
| HDI |
1+N+1 |
Rigid-flex PCB+HDI |
| 1+1+N+1+1，2+N+2 |
| 1+1+1+N+1+1+1,3+N+3 |
| Anylayer |
| Base material |
Normal Tg, Middle Tg, High Tg |
Yes |
Yes |
| Lead Free,Halogen Free |
Yes |
Yes |
| Low Dk/Low Loss Laminate |
Yes |
Yes |
| High Frequency Laminate |
Yes |
Yes |
| PI Laminate |
Yes |
Yes |
| BT Laminate |
Yes |
Yes |
| Teflon Laminate |
Yes |
Yes |
| Material supplier |
Shengyi, ITEQ, KB, TUC, Grace |
Yes |
Yes |
| Isola, Ventec, Nanya, Dopont |
| Arlon, Rogers, Wangling, Taconic |
| Bergquist, Boyu, Nelco |
| Hole |
Min. Mechanical Drill Size |
0.15mm(6mil) |
0.10mm(4mil) |
| Min. Laser Drill Size |
0.10mm(4mil) |
0.075mm(3mil) |
| Drilling Hole to Hole Accuracy |
± 0.05mm(± 2mil) |
± 0.05mm(± 2mil) |
| PTH Tolerance |
± 0.075mm(± 3mil) |
± 0.05mm(± 2mil) |
| NPTH Tolerance |
± 0.05mm(± 2mil) |
± 0.038mm(± 1.5mil) |
| Controlled Depth Drilling Tolerance |
± 0.10mm(± 4mil) |
± 0.05mm(± 2mil) |
| PTH Aspect Ratio |
12:1 |
16:1 |
| Laser Aspect Ratio |
0.8:1 |
1:1 |
| Min. Distance of hole to trace |
7mil |
6mil |
| Trace, Soldermask |
Min. Trace Width/Space |
0.075mm/0.075mm(3/3mil) |
0.05mm/0.05mm(2/2mil) |
| Trace Width Tolerance |
± 10% |
± 8% |
| Min. Base Cu Thickness |
12um(1/3 oz ) |
9um(1/4 oz ) |
| Max. Base Cu Thickness |
12 oz |
30oz |
| Impedance Control Tolerance |
± 10% |
± 5% |
| Registration＜10L |
± 0.05mm(± 2mil) |
± 0.038(± 1.5mil) |
| Registration≥10L |
± 0.075(± 3mil) |
± 0.05(± 2mil) |
| Min. SMT/QFP Pitch |
0.20mm(8mil) |
0.15mm(6mil) |
| Min. BGA Pitch |
0.23mm(9mil) |
0.20mm(8mil) |
| Min. Solder Bridge Width |
3mil |
2.5mil |
| S/M Registration Tolerance |
± 0.05mm(± 2mil) |
± 0.038mm(± 1.5mil) |
| Mechanical |
Routing Tolerance |
± 0.13mm(± 5mil) |
± 0.10mm(± 4mil) |
| Punch Tolerance |
± 0.10mm(± 4mil) |
± 0.05mm(± 2mil) |
| V-cut Location Tolerance |
± 0.10mm(± 4mil) |
± 0.075mm(± 3mil) |
| V-cut Residual Tolerance |
± 0.10mm(± 4mil) |
± 0.05mm(± 2mil) |
| Angle & Tolerance of Beveling of G/F |
20°/30°/45°/60°, ± 5° |
20°/30°/45°/60°, ± 5° |
| Depth & Tolerance of Beveling of G/F |
1.2 ± 0.20mm(47 ± 8mil) |
1.2 ± 0.10mm(47 ± 4mil) |
| Surface Treatment |
Carbon ink |
Nipon |
|
| Peelable Mask |
PETER SD2955 |
|
| OSP |
Entek Plus HT; Preflux F2 LX |
|
| ENIG |
Au: 0.02um -1um, Ni: 3um -6um |
|
| ENIG+OSP |
Yes |
|
| Immersion Tin |
0.8-1.2um |
|
| Immersion Silver |
Yes |
|
| HASL(Free) |
0.5-40um |
|
| ENEIPG |
Au: 0.015-0.075um; Pd: 0.02-0.075um; Ni: 2-6um |
|
| Electro. Hard Gold |
Au: 0.125-1.270um; Ni: 2.50-6.25um |
|
| Special Process |
Platd edge/Half Hole/Sidestep hole |
Yes |
Yes |
| Via in Pad/Back Drill/Countersink Hole |
Yes |
Yes |
| Advanced |
Buried Capacitor/Buried Resistor |
Yes |
Yes |
| Embedded coin |
Yes |
Yes |
| Rigid-Flex/Rigid-Flex + HDI |
Yes |
Yes |
